products

PSOIC / PSSOP


These off-the-shelf packages are constructed of a semiconductor grade plastic and feature a gold plated copper die attach pad and lead frame.

Open Cavity packages can be sealed with ceramic or plastic lids or with an epoxy glob top.

They have the same mechanical and electrical characteristics as their transfer molded counterparts and are fully compatible with the same test fixtures.

Advantages of PSOIC/PSSOP:

  • Newly manufactured material
  • Great quick turn assembly solution
  • Same footprint as production plastic packages
  • Easy to seal
  • Meets QQ-N-290, MIL -G45204C and MIL -Std-883 specifications
All dimensions are in inches unless otherwise specified
SSM P/NLEAD COUNTPART TYPEMFG DRW NOCAVITY SIZE (W)CAVITY SIZE (L)PKG OD (L)PKG OD (W)B/F LAYOUTLEAD CONFIGRECOM LIDCOMMENTSPDFREQ.QUOTE
PSO0815048PSOIC 500520 Rev A 0.0750.10.1950.152 GULLWING CR181403 VIEWReq.Quote
PSO14150114PSOIC SOIC14-OP-01 0.0750.10.3420.155 GULLWING PL301501 VIEWReq.Quote
PSO16150116PSOIC SOIC16-OP-01 0.0750.120.390.155 GULLWING PL301501 VIEWReq.Quote
PSO16150216PSOIC SOIC16-OP-02 REV.1 0.150.220.410.295 GULLWING CR372703 VIEWReq.Quote
PSO20300120PSOIC SOIC20-OP-01-T 0.150.220.510.31 GULLWING CR502805 VIEWReq.Quote
PSO24300124PSOIC SOIC24-OP-01-T 0.150.220.610.295 GULLWING CR502805 VIEWReq.Quote
PSP16150116PSSOP SSOP16-OP-01 0.0750.10.1930.152 GULLWING CR181401 VIEWReq.Quote
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