products

PQFP
 

These off-the-shelf packages are constructed of a semiconductor grade plastic and feature a gold plated copper die attach pad and lead frame. Open Cavity packages can be sealed with ceramic or plastic lids or with an epoxy glob top. They have the same mechanical and electrical characteristics as their transfer molded counterparts and are fully compatible with the same test fixtures.

Advantages of Open Cavity packages are:

 

  • Newly manufactured material
  • Great quick turn assembly solution
  • Same footprint as production plastic packages
  • Easy to seal
  • Meets QQ-N-290, MIL -G45204C and MIL -Std-883 specifications
All dimensions are in inches unless otherwise specified
SSM P/NLEAD COUNTPART TYPEMFG DRW NOCAVITY SIZE (W)CAVITY SIZE (L)PKG OD (L)PKG OD (W)S/R OD (L)S/R OD (W)S/R ID (L)S/R ID (W)B/F LAYOUTLEAD CONFIGRECOM LIDCOMMENTSPDFREQ.QUOTE
PLQ04401-D44LQFP LQFP44-OP-01 REV 2 0.2680.2680.3940.3940.3840.3840.3430.34311X11 Req.Quote
PLQ0440244PQFP LQFP44-OP-01 REV 3 0.2680.2680.3940.3940.3840.3840.3430.34311X11 GULLWING CR-X0002 Req.Quote
PLQ0520152PQFP LQFP52-OP-01 REV 3 0.2680.2680.3940.3940.3840.3840.3430.34313X13 GULLWING CR-38001 PAD SIZE .268 In. SQ VIEWReq.Quote
PLQ0640264PQFP LQFP10X10-64-OP-01 0.2680.2680.3940.3940.3840.3840.3430.34316X16 CR-X0002 Req.Quote
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