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Ceramic Solder Seal Lids - Rectangle


Ceramic Solder Seal lids are a variation of the metal Combo Lid™ which has been a standard in the semiconductor industry for decades.  Our variation of the combo lid features a flat 90% Alumina ceramic cover with a metalized sealing surface along the outer edge. 

The metalized sealing surface is Ni/Au plated and an industry standard preform (80Au/20Sn) is then tacked securely onto the ceramic cover.  The end result is a ceramic lid that can be solder sealed for full hermeticity that also offers the ease of handling of a metal Combo Lid™ with the added benefits of the ceramic materials. 

Some customers that have used these lids state their products meet JAN,JANTX, JANTXV and JANS quality levels per MIL-PRF-19500 and MIL-STD-750*

Advantages of Ceramic Solder Lids:

  • Increased resistance to salt spray corrosion
  • Improved hermetic seal after temp cycling due to matching thermal coefficient of expansion (TCE)
  • Ceramic surface promotes better marking of finished devices
  • Improved protection from XRAY threat

*Spectrum recommends that customers evaluate these lids in their facility for their specific application and qualification requirements.

 

 

All dimensions are in inches unless otherwise specified
SSM P/NPART TYPEMFG DRW NOTHICKNESSLID OD (L)LID OD (W)LID ID (L)LID ID (W)SEALANTCOMMENTSPDFREQ.QUOTE
CRA109002CERAMIC SOLDER LID N/A 0.020.1060.090.0710.06 WITH AU/SN PREFORM VIEWReq.Quote
CRA221502CERAMIC SOLDER LID N/A 0.020.2250.150.1850.12 WITH AU/SN PREFORM VIEWReq.Quote
CRA322601CERAMIC SOLDER LID TMC P211 0.0220.3210.2560.260.195AUSNPREFOR VIEWReq.Quote
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