Ceramic Solder Seal Lids - Rectangle
Ceramic Solder Seal lids are a variation of the metal Combo Lid™ which has been a standard in the semiconductor industry for decades. Our variation of the combo lid features a flat 90% Alumina ceramic cover with a metalized sealing surface along the outer edge.
The metalized sealing surface is Ni/Au plated and an industry standard preform (80Au/20Sn) is then tacked securely onto the ceramic cover. The end result is a ceramic lid that can be solder sealed for full hermeticity that also offers the ease of handling of a metal Combo Lid™ with the added benefits of the ceramic materials.
Some customers that have used these lids state their products meet JAN,JANTX, JANTXV and JANS quality levels per MIL-PRF-19500 and MIL-STD-750*
Advantages of Ceramic Solder Lids:
- Increased resistance to salt spray corrosion
- Improved hermetic seal after temp cycling due to matching thermal coefficient of expansion (TCE)
- Ceramic surface promotes better marking of finished devices
- Improved protection from XRAY threat
*Spectrum recommends that customers evaluate these lids in their facility for their specific application and qualification requirements.
|SSM P/N||PART TYPE||MFG DRW NO||THICKNESS||LID OD (L)||LID OD (W)||LID ID (L)||LID ID (W)||SEALANT||COMMENTS||REQ.QUOTE|
|CRA109002||CERAMIC SOLDER LID||N/A||0.02||0.106||0.09||0.071||0.06||WITH AU/SN PREFORM||VIEW||Req.Quote|
|CRA221502||CERAMIC SOLDER LID||N/A||0.02||0.225||0.15||0.185||0.12||WITH AU/SN PREFORM||VIEW||Req.Quote|