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Small Outline Integrated Circuit Package (SOIC)


The SOIC package is a surface mounted device designed to meet the demand for increasing miniaturization and component density.  The SOIC package is a rectangular "Dual In-line" style ceramic package.

The body sizes are typically smaller than a standard package. They are on a .050" lead spacing and typically come in lead counts ranging from 8-24 leads andhave a Gullwing lead configuration.

Advantages of Ceramic SOIC:

  • Multilayer Package
  • Solder, Glass or Epoxy Seal
  • Gold Plated Leads
  • Surface Mount
  • Comparable footprint to Plastic SOIC

 


 

 

All dimensions are in inches unless otherwise specified
SSM P/NLEAD COUNTPART TYPEMFG DRW NOCAVITY SIZE (W)CAVITY SIZE (L)PKG OD (L)PKG OD (W)S/R OD (L)S/R OD (W)S/R ID (L)S/R ID (W)B/F LAYOUTRECOM LIDCOMMENTSPDFREQ.QUOTE
CSO008028SOIC G1616M-1F REV D 0.070.090.180.180.1660.1660.1260.1264X0 CL-16007 VIEWReq.Quote
CSO008P38SSOP GW2112G-1 0.060.110.2080.118 4X0 VIEWReq.Quote
CSO008P48TSSOP GW2017G-2 0.080.1180.1780.123 4X0 VIEWReq.Quote
CSO0160216SOIC PB-F88151 0.170.2830.4110.2930.4040.2850.3330.2152X6 CL372609 VIEWReq.Quote
CSO0200320SOIC PB-F86652-C 0.1610.2830.5040.2930.4130.2850.3420.2154X6 CL372609 VIEWReq.Quote
CSO0200520SOP L20Z0-9020A 0.0890.1570.3420.155 6X4 LEADS TRIMMED & FORMEDVIEWReq.Quote
CSO0200620SOJ IDK20F1-7933A 0.2150.490.6750.330.6550.3120.570.23EO CL622801 VIEWReq.Quote
CSO0200720SOJ IDK20F1-7829B 0.2150.490.6750.3290.6550.3120.570.229EO CL622703 D/A CONNECTED TO GND PADVIEWReq.Quote
CSO0240424SOIC PB-F88153 0.170.2830.6060.2930.4040.2850.3330.2156X6 CL372609 VIEWReq.Quote
CSO0240624SOIC PB-F86653-A 0.1720.2850.6110.2930.4070.2880.3350.2166X6 CL372609 Req.Quote
CSO0280228SOIC PB-F88154 0.170.2830.7050.2930.4040.2850.3330.2156X8 CL372609 VIEWReq.Quote
CSO028P228SOIC GW6030G-6 0.1650.2050.60.3 6X8 VIEWReq.Quote
CSO028P328SOIC GW6030G-5 0.1650.2050.60.3 6X8 CR562702 VIEWReq.Quote
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