Spectrum Semiconductor Materials - distributor of semiconductor ceramic and plastic packaging for IC assembly.



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Spectrum offers off-the-shelf ceramic packages for all of your IC assembly requirements.

Our packaging materials are top quality - never rejects. We source most of our inventory directly from the major manufacturers: Kyocera, NTK, Williams, etc.

In addition, we buy top quality material from major IC manufacturers who have excess inventories. This often allows us to pass on substantial savings to our customers. We can provide Certificates-of-Conformance with any order upon request. In many cases we are able to provide the original manufacturer’s Certificate-of-Conformance.

Our sales staff is comprised of highly trained packaging specialists who have years of industry experience in determining the optimal package for a given application. Call us with your requirements. We will be happy to assist you in package and lid selection and provide you with the solution that best meets your assembly requirements.

Our new, expanded electronic catalog contains a complete listing of our inventory of millions of ceramic packages and lids.

CERDIP Package
Ceramic Quad Flat Package - Cerquad
Cerpac Package
Leadless Chip Carrier (LCC)
Leaded Chip Carriers/Flat Packs (LDCC)
Side-Brazed Dual In-Line Ceramic Package - "DIP"
Small Outline Integrated Circuit Package (SOIC)
Hybrid Package - Multi-Chip Module (MCM)
Pin Grid Arrays (PGA)  Ceramic | Plastic
Transistor Outlines - TO Headers
Small Outline-Surface Mount Packages
 Open Cavity Plastic Packages  PQFN (NEW!) | PQFP | PSOIC | PSSOP
Ceramic Lids
Combo LidsTM
Glass Lids
Plastic Lids



Combo Lid is a Registered Trademark of Williams Advanced Materials.

Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.

ISO 9001:2000 Certified
© copyright 2002. Spectrum Semiconductor Materials Inc. All rights reserved.
2027 O'Toole Avenue, San Jose, California 95131
Telephone: (408) 435-5555 Fax: (408) 435-8226
Email: ssm_sales@spectrum-semi.com