 | ||||||
 HOME |
 |
 |
 |
 |
 |
 |
 Register | Log In  
 
|
|
  Small Outline-Surface Mount Packages Small Outline Material Properties (PDF) View Parts ListingSmall Outline-Surface Mount Packages replicate the footprint of their plastic counter parts and provide a viable alternative to the longer turn times associated with going overseas for plastic assembly. These packages are constructed of a glass-ceramic composite material with an embedded gold-plated kovar leadframe and die attach pad. They are easily sealed with a ceramic or plastic lid with an epoxy perform or an epoxy glob top. We also offer ceramic small outline packages that can be hermetically sealed. Small outline packages are most commonly used for small quantity, quick turn assembly and test, but are just as effective in production quantities. These packages are compatible for frequencies up to 8GHz, which makes them a logical choice for telecommunications applications. View Small Outline-Surface Mount Parts Listing | Browse All Part Types Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.
|
|
ISO 9001:2000 Certified © copyright 2002. Spectrum Semiconductor Materials Inc. All rights reserved. 155 Nicholson Ln. San Jose, CA 95134 Telephone: (408) 435-5555 Fax: (408) 435-8226 Email: ssm_sales@spectrum-semi.com |