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  Small Outline Integrated Circuit Package (SOIC) Multilayer Flatpack Specifications (PDF) View Parts ListingThe SOIC package is a surface mounted device designed to meet the demand for increasing miniaturization and component density. The SOIC package is a rectangular "Dual In-line" style ceramic package. The body sizes are typically smaller than a standard package. They are on a .050" lead spacing and typically come in lead counts ranging from 8-24 leads and have a Gullwing lead configuration. We also offer plastic versions of various lead count SOICs. View SOIC Parts Listing | Browse All Part Types Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.
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ISO 9001:2000 Certified © copyright 2002. Spectrum Semiconductor Materials Inc. All rights reserved. 155 Nicholson Ln. San Jose, CA 95134 Telephone: (408) 435-5555 Fax: (408) 435-8226 Email: ssm_sales@spectrum-semi.com |