These off-the-shelf packages are constructed of a semiconductor grade plastic and feature a gold plated copper die attach pad and lead frame. Our PQFN packages can be sealed with ceramic or plastic lids or with an epoxy glob top. They have the similar and electrical characteristics as their encapsulated counterparts that are typically assembled offshore.

Advantages of PQFN packages are:

• Newly manufactured material – NOT “cleaned out” or dummy packages
• Great quick turn assembly solution
• Easy to seal
• Meets JEDEC MO-220 Standard
• Guaranteed Quality

To learn more about our PQFN product line, please contact us at qfn@spectrum-semi.com.

View PQFN Parts Listing   |   Browse All Part Types