These off-the-shelf packages are constructed of a semiconductor grade plastic and feature a gold plated copper die attach pad and lead frame. Open Cavity packages can be sealed with ceramic or plastic lids or with an epoxy glob top. They have the same mechanical and electrical characteristics as their transfer molded counterparts and are fully compatible with the same test fixtures.

Advantages of Open Cavity packages are:

• Newly manufactured material
• Great quick turn assembly solution
• Same footprint as production plastic packages
• Easy to seal
• Meets QQ-N-290, MIL -G45204C and MIL -Std-883 specifications

To learn more about our Open Cavity plastic packages, please contact us at ssm_sales@spectrum-semi.com.


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