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  Plastic Pin Grid Array KCW-10 Heat Sink Material (PDF) View Parts ListingPlastic Pin Grid Arrays were first developed in 1993 to combat power supply decoupling issues in high-performance microprocessors. This square chip packaging technology was designed for microprocessors with greater numbers of transistors on each chip than previous models. Unlike ceramic pin grid arrays (CPGA) the PPGA package offers a greater amount of thermal resistance, improved electrical performance and power distribution. All of which directly affect the potential performance of microprocessors sensitive to heat transmission. View Plastic PGA Parts Listing | Browse All Part Types Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.
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ISO 9001:2000 Certified © copyright 2002. Spectrum Semiconductor Materials Inc. All rights reserved. 2027 O'Toole Avenue, San Jose, California 95131 Telephone: (408) 435-5555 Fax: (408) 435-8226 Email: ssm_sales@spectrum-semi.com |