Spectrum Semiconductor Materials: Open Pak– Open Cavity Plastic packages - SOIC - LQFP


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Open Pak
(Open Cavity Plastic Package)

  SOIC and LQFP Outlines Available!

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 Open Pak Technical Data (PDF)
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These off-the-shelf packages are constructed of a semiconductor grade plastic and feature a gold plated copper die attach pad and lead frame. Open-Pak™ packages can be sealed with ceramic or plastic lids or with an epoxy glob top. They have the same mechanical and electrical characteristics as their transfer molded counterparts and are fully compatible with the same test fixtures.

Advantages of Open-Pak™ packages are:
  • Newly manufactured material
  • Great quickturn assembly solution
  • Same footprint as production plastic packages
  • Easy to seal
  • Meets QQ-N-290, MIL-G45204C and MIL-Std-883 specifications

To learn more about our Open-PakTM product line, please contact us at openpak@spectrum-semi.com.

View Open Cavity Parts Listing   |   Browse All Part Types

Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.

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Telephone: (408) 435-5555 Fax: (408) 435-8226
Email: ssm_sales@spectrum-semi.com