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  Hybrid Package - Multi-Chip Module (MCM) Multilayer Dual In-Line Specifications (PDF) View Parts ListingA Hybrid Package is a special carrier of hybrid microcircuits and components interconnected as one unit. It can be considered a component of an electronic subsystem. The Hybrid may consist of a single construction or be made up of sub-modules. Each module usually contains a compartment to house the hermetically packaged hybrids and discrete passive component parts such as transformers, axle-lead resistors, etc. These packages come in a wide variety of package configurations; Ceramic, Metal, DIP style and Flat Pack. View Hybrid Parts Listing | Browse All Part Types Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.
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ISO 9001:2000 Certified © copyright 2002. Spectrum Semiconductor Materials Inc. All rights reserved. 155 Nicholson Ln. San Jose, CA 95134 Telephone: (408) 435-5555 Fax: (408) 435-8226 Email: ssm_sales@spectrum-semi.com |