Spectrum Semiconductor Materials: Leaded Chip Carriers (LDCC)



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Leaded Chip Carriers/Flat Packs (LDCC)

 Multilayer Flatpack Specifications (PDF)
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Leaded Chip Carriers, known also as Flat Packs, are typically found in lower lead counts; 8-28 leads. Quad Flat Packs and J - Bend Chip Carriers are typically found in higher lead counts.

Flat Packs have small body outlines and are lightweight. They usually have leads on two sides of the package, which are parallel to the seating plane. Due to these characteristics the Flat Pack is commonly used in Hi-Rel applications for military airborne equipment.

Quad Flat Packs, QFP's or JLDCC's, are typically found with leads greater than 24 and have leads on all four sides of the ceramic body. The leads are either Flat, Gullwing or J-Bend configured. These packages are hermetically sealed and are used for surface mount applications. They can be soldered directly to a PC Board or used in a socket. The lead spacing depending on the package can come in .015, .020, .025 and .050 inches.

Advantages of the LDCC's:
  • Hermeticity
  • Leads allow package to expand/contract without placing undue stress on the package to PCB connection


View LDCC Parts Listing   |   Browse All Part Types





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