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  Leadless Chip Carrier (LCC) LCC Specifications (Avail. Upon Request) View Parts ListingJEDEC type Leadless Chip Carriers continue to be a popular package for surface mount applications. The Leadless Chip Carrier's low profile and multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and on the bottom of the package. These outside contacts are normally .040" or .050" on center. JEDEC outlines come in configurations with Type C being the most popular. The carrier can be soldered directly to the PC Board or used in a socket. Direct soldering of lead counts higher than 44 is not recommended where temperatures can fluctuate above 70o C. This can cause TCE, "thermal mismatch", between the PC Board and the package resulting in solder connection failures at the board level. The Leaded Chip Carrier addresses the TCE issue as it has the ability to release thermal stress through the leadframe thereby preventing solder connection failure. View LCC Parts Listing | Browse All Part Types Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.
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ISO 9001:2008 Certified © copyright 2002. Spectrum Semiconductor Materials Inc. All rights reserved. 155 Nicholson Ln. San Jose, CA 95134 Telephone: (408) 435-5555 Fax: (408) 435-8226 Email: ssm_sales@spectrum-semi.com |