Spectrum Semiconductor Materials: Ceramic Side Braze/DIP packages



 HOME

 Register | Log In















Side Brazed DIPSide-Brazed Dual In-Line Ceramic Package - (DIP)

 Multilayer Dual In-Line Specifications (PDF)
 View Parts Listing

The standard Sidebraze package, commonly known as a "DIP", consists of two rows of leads brazed onto the sides of the ceramic. The row spacing varies from leadcount, but can come in .300, .400, .600 and .900 inch wide configurations.

The DIP is extremely popular due to its reliability and ease of use. As the lead count increases, the package size increases sharply thereby reducing the space efficiency. As the lead count increases, the internal lead traces also increase. This will increase the electrical characteristics of the package (i.e. inductance, resistance and impedance).

Advantages of DIP:
  • High performance and realibility
  • Ease of PC board mounting via socket, manual or automated equipment
  • Ease of soldering and reliable removal techniques
  • Lead spacing matches common PC Board layouts and allow one or more leads to run between the PC Board holes
  • Effective heat dissipation
  • Hermetically seal using solder, glass or epoxy


View Side Brazed DIP Parts Listing   |   Browse All Part Types



Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.
ISO 9001:2000 Certified
© copyright 2002. Spectrum Semiconductor Materials Inc. All rights reserved.
155 Nicholson Ln. San Jose, CA 95134
Telephone: (408) 435-5555 Fax: (408) 435-8226
Email: ssm_sales@spectrum-semi.com