Spectrum Semiconductor Materials: Ceramic Pin Grid Array (PGA)


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Ceramic Pin Grid Array - (CPGA)

CPGA Specifications (PDF)

KCW-10 Heat Sink Material (PDF)

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Ceramic Pin Grid Array Packages offer high I/O signal carrying capacity, excellent electrical performance and high thermal heat dissipation, with minimum package size. This through-hole mount package is typically square in shape with gold-plated pins brazed in a matrix pattern to the bottom or top of the package. CPGAs are designed for low inductance and enhanced thermal performance. Higher lead counts typically come with a cavity down orientation for potential application of a Heat Sink to assist in thermal dissipation.

Advantages of CPG's are:

The ability to handle many I/O's
Rugged construction
True hermetic encapsulation
Small footprint relative to pin count
Effective heat dissipation
Ease of PC board mounting

If hermeticity is not critical to your needs then we have a low cost version available. These packages are PPGA's or Plastic Pin Grid Arrays. Please ask your Spectrum Representative about PPGA's as inventory is limited.

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Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.

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