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  Combo LidsTM Solder Lid Sealing (PDF) View Parts ListingSolder Seal Lids, also known as Combo LidsTM, have long been a standard of the semiconductor industry for high reliability and hermetic package sealing. Standard lids are produced with Alloy 42 or Kovar, are plated with nickel and gold, and feature a gold tin eutectic frame already attached to the lid. Performance has been improved with the release of Hi-Rel Combo LidsTM. The technology of the Hi-Rel lids has significantly improved the resistance to corrosion and moisture. Hi-Rel Combo LidsTM are also made with Alloy 42 or Kovar and a multi-layer plating process is used (Ni/Au/Ni/Au). They also conform to military standard MIL-M-38510. The outer layer of gold is 25 micro inches minimum and the sum of both gold layers is 50 micro inches minimum. Each of the two nickel layers is 50-350 micro inches and the sum of both Ni layers does not exceed 450 micro inches. Advantages of Combo LidsTM:
View Combo LidsTM Parts Listing | Browse All Part Types Combo Lid is a Registered Trademark of Williams Advanced Materials.
Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com. |
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