Spectrum Semiconductor Materials: Ceramic Quad Flat Package (Cerquad)


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Ceramic Quad Flat Package - Cerquad

Cerquad Technotes (PDF)

Cerquad Specifications (PDF)

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The Quad Cerpac Base is a surface mount package is available in a variety of body sizes. The lead pitch is based on two standards: JEDEC and EIAJ. The JEDEC outlines will typically have lead spacing of .025 or .050 inch. EIAJ outlines will have lead spacing measured in millimeters; .65mm, .80mm, and 1.00mm. The lead counts of these packages will range from 28 to 240.

Cerquad packages are constructed of a single layer of 92% Alumina (AI203), with a leadframe embedded into a non-vitreous glass. The lead configurations are either flat leaded, J-bend, or gullwing. These packages do not have a metallized seal ring and they do take a ceramic cap. Some packages are designed with a ceramic window frame which is attached to the top of the base providing added strength. Hermetic and non-hermetic versions are available.

Advantages of the Ceramic Quad Flat Pack - Cerquad Package:

The ability to handle thermal stress
The similarity to Plastic Quad Flat Packages which allow for an ideal package equivalent for prototyping.
Low cost alternative to LDCC's.

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