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  Ceramic Lids Ceramic Lid Specifications (Avail. Upon Request) View Parts ListingCeramic lids can be used on almost any package style or type, although the most common use is on Cerquad and Cerpac style packages. They typically feature a high temperature glass sealant, for hermetic applications, or a low temperature B stage epoxy sealant were hermeticity is not a concern. Another common use of ceramic lids is on packages where low sealing temperatures are required. Glass lids come in a variety of sizes, shapes and thickness. They are also available with glass or quartz windows for EPROM applications. Advantages of Ceramic lids:
View Ceramic Lid Parts Listing | Browse All Part Types Have a question? Call 408.435.5555 or email ssm_sales@spectrum-semi.com.
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ISO 9001:2008 Certified © copyright 2002. Spectrum Semiconductor Materials Inc. All rights reserved. 155 Nicholson Ln. San Jose, CA 95134 Telephone: (408) 435-5555 Fax: (408) 435-8226 Email: ssm_sales@spectrum-semi.com |